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DIMA HP-100

Takt time: 1.16 s/QFP with area CCD camera, 0.85 s/chip with closed loop electromechanical alignment. Optimum placement rate: 3,125 cph (components per hour) according to IPC 9850 with area SCC & LCC cameras, 4,200 cph according to IPC 9850 with CLEA. Nominal placement rate: 2,500–3,500 cph. Processable component types: 0201 chip, MELF, SOT, SOIC, TSOP, TNT, PLCC, QFP, BGA, µBGA, LCC. Maximum field size: 42x42 mm. Fine pitch: up to 0.4 mm (16 mil). Tool change station: 12 nozzle positions. Heads: single gantry with two independently controlled pick-and-place pipettes. Placement accuracy (X/Y) 3σ: 50µm with area CCD camera, 100µm with closed loop electromechanical alignment. PCB dimensions (X/Y): 30–330 x 30–450 mm. PCB alignment: fiducial recognition via ESI CorrectPlace® including teach-in for vias or irregular contours. Loading and alignment time: approx. 2.8 s. Number of axes: 2. Length: 1,700 mm, width: 1,500 mm, height: 2,200 mm, weight: 450 kg without feeders. On-site inspection is possible.
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